Infineon, 6ED2230S12T, 1200 V, Three Phase, Gate Driver

 T he high-voltage, high-speed 6ED2230S12T IGBT includes three independent high side and low side referenced output channels for three phase applications. This Infineon gate driver’s proprietary HVIC and latch immune CMOS technologies enable ruggedized monolithic construction. The 6ED2230S12T’s logic input is compatible with standard CMOS or TTL outputs, down to 3.3 V logic, while an over‐current protection (OCP) function terminates all six outputs and can also be derived from this resistor.

https://www.futureelectronics.com/npi/infineon-6ed2230s12t-three-phase-gate-driver

NXP, i.MX RT1170, Crossover MCU Family

 The i.MX RT1170 crossover MCUs are setting speed records at 1 GHz. This ground-breaking family combines superior computing power and multiple media capabilities with ease of use and real-time functionality.

https://www.futureelectronics.com/npi/nxp-imx-rt1170-crossover-mcu

Microchip, MCP3461R/MCP3561R, Analog to Digital Converter, ADC

 he Microchip MCP3461R (MCP3561R) is a low-noise 16(24)-bit Delta-Sigma Analog-to-Digital Converter (ADC), with two single-ended or one differential input channels and programmable data rate of up to 153.6 kSPS. The ADC converters offer integrated features such as internal Vref, an oscillator, temperature sensor and burnout sensor detection, to reduce system component count and total solution cost.

https://www.futureelectronics.com/npi/microchip-mcp3461r-mcp3561r-adc

u-blox, SARA-R5 Series, LTE-M / NB-IoT Modules

 The u-blox SARA-R5 series modules are based on the UBX-R5 cellular chipset and the u blox M8 GNSS receiver chip. By bringing all technology building blocks in house and having full hardware and software ownership, u blox can guarantee long-term device availability and provide lifetime support of the entire platform, down to the chipset level.

https://www.futureelectronics.com/npi/u-blox-sara-r5-series-lte-m-module

STMicroelectronics, IIS2ICLX Two-Axis Inclinometer, Embedded Machine Learning Core

 The STMicroelectronics IIS2ICLX has an unmatched set of embedded features (programmable FSM, Machine Learning Core mentioned above, sensor hub, FIFO, event decoding and interrupts) which are enablers for implementing smart and complex sensor nodes that deliver high accuracy and performance at exceptionally low power.

https://www.futureelectronics.com/npi/stmicroelectronics-iis2iclx-2-axis-digital-inclinometer

Laird Connectivity, BL653μ, Series Bluetooth 802.15.4 NFC, Modules

 Laird Connectivity’s latest range of Nordic nRF52833 based modules specifically targets OEMs where space is constrained in their designs. Yet still the miniaturized BL653μ series enables Industrial OEMs to robustly implement longer range Bluetooth LE applications in the harshest operating environments.

https://www.futureelectronics.com/npi/laird-connectivity-bl653u-bluetooth-nfc-modules

Infineon,CYW4373E, Single-Chip Dual Band WiFi, Radio with Bluetooth

 Powered by Infineon’s CYW4373E silicon, the Sterling-LWB5+ is purpose-built for IoT connectivity through a secure, reliable, and robust feature set. The Sterling-LWB5+ is innovative IoT from the start: fully certified, easy to integrate, and is the fastest route to the market for IoT.

https://www.futureelectronics.com/npi/laird-connectivity-sterling-lwb5-wifi-bluetooth-modules