The MEMS sensor module
family from ST leverages the robust and mature manufacturing processes already
used for the production of micromachined accelerometers and gyroscopes to serve
automotive, industrial and consumer markets. The sensing elements are
manufactured using ST’s proprietary micromachining process, while the embedded
IC interfaces are developed using CMOS technology.
https://www.futureelectronics.com/npi/stmicroelectronics-3-axis-digital-vibration-sensor-IIS3DWB
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